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Volumn 1, Issue , 2006, Pages 196-199
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An ultra small SAW RF filter using wafer level packaging technology
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Author keywords
SAW(surface acoustic wave) filter; TWI(through wafer interconnection); Wafer bonding; Wafer level packaging
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Indexed keywords
ACOUSTIC SURFACE WAVE DEVICES;
ACOUSTIC SURFACE WAVE FILTERS;
ACOUSTIC WAVE VELOCITY;
ACOUSTIC WAVES;
ACOUSTICS;
CARBON DIOXIDE ARC WELDING;
CHIP SCALE PACKAGES;
ELECTRIC CURRENTS;
ELECTRIC FILTERS;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
MICROELECTROMECHANICAL DEVICES;
MOBILE PHONES;
OPTICAL DESIGN;
SAWING;
TECHNOLOGY;
TELECOMMUNICATION;
TELECOMMUNICATION EQUIPMENT;
TELEPHONE;
TELEPHONE SETS;
TELEPHONE SYSTEMS;
ULTRASONICS;
WAVE FILTERS;
ACOUSTOELECTRIC EFFECTS;
MOBILE TELECOMMUNICATION SYSTEMS;
PACKAGING;
WIRELESS TELECOMMUNICATION SYSTEMS;
DRIVING FORCES;
EVOLUTION (CO);
FUNCTIONAL INTEGRATION;
INTERNATIONAL (CO);
KEY COMPONENTS;
MOBILE PHONE SYSTEMS;
RADIO FREQUENCY (RF);
RF FILTERING;
RF FILTERS;
SAW FILTERS;
SIZE REDUCTIONS;
SURFACE ACOUSTIC WAVE (SAW);
ULTRA-SMALL;
WAFER LEVEL PACKAGING (WLP) TECHNOLOGY;
WAFER TO WAFER BONDING;
WIRELESS (WIFI) COMMUNICATION;
WAFER BONDING;
DRIVING FORCES;
FREQUENCY CHARACTERISTIC;
FUNCTIONAL INTEGRATION;
KEY COMPONENT;
MOBILE PHONE SYSTEMS;
RADIO FREQUENCY FILTERS;
RELIABILITY TEST;
RF FILTERS;
SA WFILTER;
SIZE REDUCTIONS;
SURFACE ACOUSTIC WAVE FILTERS;
SURFACE ACOUSTIC WAVES;
THROUGH WAFER INTERCONNECTION;
ULTRA-SMALL;
WAFER INTERCONNECTIONS;
WAFER LEVEL;
WAFER LEVEL PACKAGING;
WAFER TO WAFER BONDING;
WAFER-LEVEL PACKAGING TECHNOLOGY;
WIRELESS COMMUNICATIONS;
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EID: 47249113970
PISSN: 10510117
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ULTSYM.2006.62 Document Type: Conference Paper |
Times cited : (13)
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References (5)
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