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Volumn 1, Issue , 2006, Pages 196-199

An ultra small SAW RF filter using wafer level packaging technology

Author keywords

SAW(surface acoustic wave) filter; TWI(through wafer interconnection); Wafer bonding; Wafer level packaging

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC SURFACE WAVE FILTERS; ACOUSTIC WAVE VELOCITY; ACOUSTIC WAVES; ACOUSTICS; CARBON DIOXIDE ARC WELDING; CHIP SCALE PACKAGES; ELECTRIC CURRENTS; ELECTRIC FILTERS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; MOBILE PHONES; OPTICAL DESIGN; SAWING; TECHNOLOGY; TELECOMMUNICATION; TELECOMMUNICATION EQUIPMENT; TELEPHONE; TELEPHONE SETS; TELEPHONE SYSTEMS; ULTRASONICS; WAVE FILTERS; ACOUSTOELECTRIC EFFECTS; MOBILE TELECOMMUNICATION SYSTEMS; PACKAGING; WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 47249113970     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2006.62     Document Type: Conference Paper
Times cited : (13)

References (5)
  • 1
    • 0035729025 scopus 로고    scopus 로고
    • Recent Advances in SAW Packaging
    • P. Selmeier et al., "Recent Advances in SAW Packaging," IEEE Ultrasonics Symposium, pp. 283-292, 2001.
    • (2001) IEEE Ultrasonics Symposium , pp. 283-292
    • Selmeier, P.1
  • 2
    • 0036403012 scopus 로고    scopus 로고
    • Chip Scale Packaging Techniques for RF SAW Devices
    • M. Goetz and C. Jones, " Chip Scale Packaging Techniques for RF SAW Devices," IEEE/SEMI Int'l. Elec. Manuf. Tech. Symp., Vol. 27, pp. 63-66, 2002.
    • (2002) IEEE/SEMI Int'l. Elec. Manuf. Tech. Symp , vol.27 , pp. 63-66
    • Goetz, M.1    Jones, C.2
  • 5
    • 84876548549 scopus 로고    scopus 로고
    • Development and Characterization of Wafer-Level Hermetic Package for RF MEMS Applications
    • San Diego, California U.S.A
    • S. J. Ham et al., "Development and Characterization of Wafer-Level Hermetic Package for RF MEMS Applications," 39th International Symposium on Microelectronics (IMAPS 2006), San Diego, California U.S.A., 2006.
    • (2006) 39th International Symposium on Microelectronics (IMAPS
    • Ham, S.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.