Material systems enable high density packaging

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Todd, Michael ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ROBUST CONTROL; SHEET MOLDING COMPOUNDS; SILICON;

COMPLEX HIGH DENSITY; MATERIALS SYSTEMS OPTIMIZATION;

DENSITY (SPECIFIC GRAVITY);

EID: 41049101840     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283548     Document Type: Conference Paper

References (5)

1. Dreiza, M. et al, "Stacked Die Package Design Guidelines", Proc IMAPS Conference, 2004
2. Karnezos, M. et al, "Stacked Die Packaging: Technology Toolbox, Step 8", Advanced Packaging, 2004.
3. Mathews, D. J. et al, "RF System in Package: Considerations, Technologies and Solutions"
4. Maekawa, Shinichi, "Recent assembly process technology to achieve the 9 stacked MCP," Proc 12th Annual International KGD Packaging & Test Workshop, Napa, CA, Sept. 2005.
5. Hynix Corporation