An actively cooled heat sink integrated with synthetic jets

Proceedings of the National Heat Transfer Conference

Volumn 1, Issue , 2001, Pages 199-204

  Mahalingam, Raghav ^a   Glezer, Ari ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SPREADERS; SYNTHETIC JET COOLING;

ACTUATORS; BOUNDARY LAYERS; DIAPHRAGMS; FINS (HEAT EXCHANGE); HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; INTEGRATED CIRCUITS; JETS; MICROPROCESSOR CHIPS; NATURAL CONVECTION; ORIFICES; SEMICONDUCTOR JUNCTIONS; SENSORS; THERMOCOUPLES;

HEAT SINKS;

EID: 0003345618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Bar-Cohen, A., "Computer-Related Thermal Packaging at the Millennial Divide", Electronics Cooling, v. 6, n. 1, January 2000, pp. 32-40.
2. International Technology Roadmap for Semiconductors, 1999 Edition, Semiconductors Industries Association Report, http://www.semichips.org/index2.htm
3. Jambunathan, K., Lai, E., Moss, M. A., Button, B. L., "A Review of Heat Transfer Data for Single Circular Jet Impingement", International Journal of Heat and Fluid Flow, 1992, v.13, pp. 106-115.
4. Russell, G. B., "Local- and System-Level Thermal Management of a Single Level Integrated Module (SLIM) using Synthetic Jets", M.S. Thesis, Georgia Institute of Technology, Atlanta, GA, 1999.
5. Smith, B. L., and Glezer, A., "The Formation and Evolution of Synthetic Jets", Physics of Fluids, Vol. 10, No. 9, Sept. 1998, pp. 2281-2297.
6. Thompson, M. R., Denny, D. L., Black, W. Z., Hartley, J. G., and Glezer, A., "Cooling of Microelectronic Devices using Synthetic Jet Technology", 11th European Microelectronics Conference, Venice, Italy, 1997, pp. 362-366.