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Volumn , Issue , 2008, Pages 533-538

Power reduction of functional units considering temperature and process variations

Author keywords

[No Author keywords available]

Indexed keywords

BINDING MECHANISMS; DEVICE DIMENSIONS; FUNCTIONAL UNITS (FU); INTERNATIONAL CONFERENCES; LEAKAGE POWER; POWER DENSITY (PD); POWER OPTIMIZATION; POWER REDUCTIONS; PROCESS VARIATIONS; STANDARD DEVIATION (STD); SUPERSCALAR PROCESSORS; TECHNOLOGY SCALING; TOTAL ENERGY CONSUMPTION; VLSI DESIGNS;

EID: 47649085412     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSI.2008.81     Document Type: Conference Paper
Times cited : (4)

References (19)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.