On the role of extrinsic and intrinsic defects in the underpotential deposition of cu on thiol-modified Au(111) electrodes

Journal of Physical Chemistry C

Volumn 112, Issue 10, 2008, Pages 3881-3890

  Silien, Christophe ^a   Buck, Manfred ^a  

^a UNIVERSITY OF ST ANDREWS   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; AMPLITUDE MODULATION; COPPER ALLOYS; ELECTROCHEMICAL ELECTRODES; ELECTRODES; EPITAXIAL GROWTH; GOLD; IMAGING TECHNIQUES; METALLIZING; METALS; MICROSCOPIC EXAMINATION; MISSILE BASES; NUCLEATION; PASSIVATION; SCANNING TUNNELING MICROSCOPY; SELF ASSEMBLED MONOLAYERS; STRUCTURAL METALS; SURFACE STRUCTURE;

ALKANE-THIOLS; AMERICAN CHEMICAL SOCIETY (ACS); AU (1 1 1); CU(TI) FILM; DOMAIN BOUNDARIES; ELECTROCHEMICAL SCANNING TUNNELING MICROSCOPY (ECSTM); ELECTRODE PASSIVATION; ETHANETHIOL; EXTRINSIC DEFECTS; GROWTH PROCESSES; IN-SITU; INTRINSIC DEFECTS; INTRINSIC STRUCTURES; METAL STRUCTURES; NANO-ISLANDS; NUCLEATION AND GROWTH; NUCLEATION CENTERS; NUCLEATION SITES; SELF ASSEMBLED MONOLAYERS (SAMS); STEP EDGES; SUBSTRATE INTERFACES; UNDER POTENTIAL DEPOSITION (UPD); VACANCY ISLANDS;

COPPER;

EID: 47249102957     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp710947r     Document Type: Article

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