The development of the COST 531 lead-free solders thermodynamic database

JOM

Volumn 59, Issue 7, 2007, Pages 20-25

  Kroupa, A ^a   Dinsdale, A T ^b   Watson, A ^c   Vrestal, J ^d   Vizdal J ^e   Zemanova, A ^a  

^a INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

^c UNIVERSITY OF LEEDS   (United Kingdom)

^d MASARYK UNIVERSITY   (Czech Republic)

^e UNIVERSITY OF VIENNA   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; INTERNATIONAL COOPERATION; LEAD; NICKEL; SILVER; SOLDERING ALLOYS; THERMODYNAMIC PROPERTIES; THERMODYNAMICS; TIN; TIN ALLOYS; WELDING; ZINC;

EUROPEAN; LEAD FREE SOLDER MATERIALS; LEAD-FREE SOLDER (SN-3.5AG-0.5CU); MULTI COMPONENT SYSTEMS; TECHNICAL RESEARCH;

DATABASE SYSTEMS;

EID: 47049130997     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-007-0084-6     Document Type: Review

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