Effect of substrate temperature and deposition rate on alloyzation for Co or Fe onto Cu(001) substrate

Journal of Applied Physics

Volumn 103, Issue 12, 2008, Pages

  Hong, Zheng Han ^a   Hwang, Shun Fa ^a   Fang, Te Hua ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC PHYSICS; ATOMS; COBALT; COPPER; COPPER ALLOYS; DEPOSITION RATES; DISTRIBUTION FUNCTIONS; DYNAMICS; EPITAXIAL FILMS; EPITAXIAL GROWTH; FILM GROWTH; IRON; MIXING; MOLECULAR BEAM EPITAXY; MOLECULAR DYNAMICS; QUANTUM CHEMISTRY; RATE CONSTANTS; SCALE (DEPOSITS); TEMPERATURE;

AMERICAN INSTITUTE OF PHYSICS (AIP); ATOMIC INTERACTIONS; CU ATOMS; DEPOSITED LAYERS; FE ATOMS; INTERFACE MIXING; LOW SUBSTRATE TEMPERATURE; MANY-BODY POTENTIALS; RADIAL DISTRIBUTION FUNCTION (RDF); SUBSTRATE TEMPERATURE (ST); TIGHT-BINDING (TB);

SUBSTRATES;

EID: 46449131690     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2946719     Document Type: Article

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