Optical performance of extreme-ultraviolet lithography for 50 nm generation

Guangxue Xuebao/Acta Optica Sinica

Volumn 24, Issue 7, 2004, Pages 865-868

  Li, Yanqiu ^a  

^a INSTITUTE OF ELECTRICAL ENGINEERING   (China)

Author keywords

Applied optics; Extreme ultraviolet lithography; Next generation lithography; Optical design

Indexed keywords

OPTICAL DESIGN; OPTICAL RESOLVING POWER; PHOTOLITHOGRAPHY; ULTRAVIOLET INSTRUMENTS;

EXPOSURE AREA; EXTREME ULTRAVIOLET LITHOGRAPHY; OBJECT LENSES; OPTICAL PERFORMANCE; PROJECTION OPTICS;

OPTICAL INSTRUMENT LENSES;

EID: 4644223505     PISSN: 02532239     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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2. Li Yanqiu. The evolution and a tendency of optical lithography. Microfabrication Technology, 2003, 2: 1-5 (in Chinese)
3. Griff Resor. Lithography Review, Semi Newsletter Service, 2002, 4(9), may, www.semi.org
4. Kinoshita H, Kurihara K, Ishii Y et al. Soft X-ray reduction lithography using multilayer mirrors. J. Vac. Sci. Technol., 1989, B7: 1648-1652
5. Li Yanqiu, Kinoshita H, Watanabe T et al.. An illumination system design for three aspherical mirror projection camera of extreme ultraviolet lithography. Appl. Opt., 2000, 39(19): 3253-3260
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7. Ota K, Nishiyama I, Ogawa T et al.. Current status of extreme ultraviolet lithography in Japan. Optics and Precision Engineering, 2001, 9(2): 424-429
8. Jin Chunshui, Ma Yueying, Pei Shu et al.. Development of an experimental EUVL system. Optics and Precision Engineering, 2001, 9(2): 418-423
9. Watanabe T, Kinoshita H, Nii H et al.. Development of the large field extrem ultraviolet lithography camera. J. Vac. Sci. Technol. B, 2000, 18(6): 2905-2910
10. Lee S H, Tichenor D A, Naulleau P. Lithography aerial-image contrast measurement in the extreme ultraviolet engineering test stand. J. Vac. Sci. Technol., 2002, B20(6): 2849-2855
11. Li Yanqiu, Ota K, Murakami K. Thermal and structural deformation and its impact on optical performance of projection optics for EUVL. J. Vac. Sci. Technol., 2003. B21(1): 127-129