Considerations for using low dielectric constant material as re-passivation layer on 300mm wafer bump process and manufacturing benefits of Flip Chip package

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 5-9

  Yu, Rick ^a   Tai, Tom ^a   Hsieh, Adren ^a   Cheng, Andes ^a   Tseng, Ian ^a   Tsai, Mars ^a   Tong, Homing ^a   Lee, J J ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL RESISTANCE; ENERGY DISPERSIVE SPECTROSCOPY; HEAT RESISTANCE; PASSIVATION; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH;

FLIP CHIP PACKAGES; HIGH TEMPERATURE STORAGE LIFE (HTSL); PHOTO-SENSITIVE POLYIMIDE (PSPI); TEMPERATURE CYCLE TEST (TCT);

FLIP CHIP DEVICES;

EID: 4644220323     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. S.C. Hung, P.J. Zheng, H.N. Chen, The International Journal of Microcircuits and Electronic Packaging, Volume 23, Numberl, First Quarteer 2000.
2. ND Level Reliability of a Fine Pitch BGA Package", Proceedings of1998 Surface Mount International Conference and Exposition, pp. 105-111, San Jose, California, August 23-27, 1998.
3. st International Sysposium on Microelectronic, IMAPS '98, pp 828-833, Sam Diego, California, November 2-4, 1998
4. M.S. Liang, S.C. Hung, P.J. Zheng, and H.N. Chen, "Reliability and Failure Analysis of PBGA Assembly under Bending Cyclic Test", SEMICON Taiwan, pp. 145-151, Taipei, Taiwan, September 12-16, 1999.
5. S.C. Huang, P.J. Zheng, S.H. Ho, and H.N. Chen, "Thermal Cyclic Fatigue of the Interconnect of a Flex-Type BGA", to be Presented in the Proceedings of Electronic Components and Technology Conference, ECTC '2000, Las Vegas, Nevada, May 21-24, 2000.
6. P.J. Zheng, S.C. Hung, H.N. Chhen, S.C. Lee, and J.J. Lee, "Reliability and Failure Analysis of PBGA Package", SEMICON Taiwan, pp.67-73, Taipei, Taiwan, September12-16, 1999.
7. K. N. Tu, K, Zeng, "Tin-lead(SnPb) solder reaction in flip chip technology" Material s Science and Engineering R 34(2001)1-58
8. th IEEE/CPMT International Electronics Manufacturing Technology Symposium, 18-19 October 1999, Austin, USA, IEEE, Piscataway, USA, 1999, pp. 7-15.
9. G.Z. Pan, A.A. Liu, H.K. Kim, K.N. Tu, P.A. Totta, Microstructure of phase- in Cr-Cu/ Cu/ Au bump-limiting metallization and its solder behavior with high Pb and eutectic SnPb solders, Appl. Phys. Lett. 71 (20)(1997) 2946-2948.
10. S.H.Ho, P.J. Zheng, J.D. Wu, and S.C. Hung "On the Reliability and Failure of PBGA Interconnects under Bending Cyclic Test", IMAPS2000-Bostoon, 2000.
11. "EIAJ ED-4702 Mechanical Stress Test Methods for Semiconductor Surface Mounting Devices" Electronic Industries Association of Japan, 1992.
12. Larry Leicht and Andrew Skipor, "Mechanical Cycling Fatigue of PBGA Package Interconnects", pp828-833, CA IMAPS Conf. 1998.
13. J.H. Lau and Y. Pao, "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies", MacGraw-Hill, 1997.
14. International Roadmap for Semiconductor Technology, Semiconductor Industry Association, San Jose, CA, 1999.
15. E.M. Davis, W.E. Harding, R.S. Schwartz, J.J. Corning, Solid logic technology: versatile, high performance microelectronics, IBM J. Res. Develop.44 (1/2) (2000)56-68.
16. S.J.Cho,thin solid films,417 (2002) 175-179
17. G.S Chung,thin solid films,357 (1999) 91-97
18. Sadayuki Ukishima, thin solid films,308-389 (1997) 475-479
19. T.Nishino,polymer41 (2000) 6913-6918
20. K.J.Kim, thin solid films, 398-399 (2001) 657-662
21. J.V.Gulmine,POLYMER TESTING,21 (2002)557-563
22. K.Sahre,Surface and Coatings Technology 139 (2001) 257-264
23. J.Yu,polymer,41 (2000), 169-177