Thermal cyclic fatigue of the interconnect of a flex-type BGA

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1384-1391

  Hung, S C ^a   Zheng, P J ^a   Lee, S C ^a   Ho, S H ^a   Chen, H N ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FATIGUE OF MATERIALS; POLYIMIDES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; RELIABILITY; SOLDERED JOINTS; SUBSTRATES; THERMAL CYCLING;

BALL GRID ARRAY; SOLDER BALLS; THERMAL CYCLIC TEST;

ELECTRONICS PACKAGING;

EID: 0034481625     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)