Advanced defect characterization by STEM analysis

Electronic Device Failure Analysis

Volumn 10, Issue 2, 2008, Pages 20-28

  Subramanian, Sam ^a   Rai, Raghaw ^a   Ly, Khiem ^a   Chrastecky, Tony ^a   Mulder, Randy ^a   Harber, Keith ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL TEM; DEFECT CHARACTERIZATION; PHASE CONTRAST IMAGING; STEM ANALYSIS;

SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS;

SEMICONDUCTOR DEVICES;

EID: 45749105619     PISSN: 15370755     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. S. Subramanian, R.S. Rai, S. Bagchi, and V.S. Kaushik: "Transmission Electron Microscopy for Failure Analysis of Integrated Circuits," Microelectronic Failure Analysis Desk Reference, 5th ed., ASM International, 2004, p. 595.
2. K. Li, E. Er, and S. Redkar: "STEM Imaging Applications in Deep-Sub-Micron Failure Analysis and Process Characterization," Proc. 10th Int. Symp. Phys. and failure Analysis of Integr. Circuits (IPFA), 2003, p. 206.
3. D.B. Williams and C.B. Carter: Transmission Electron Microscopy, Plenum Press, NY, 1996.
4. R. Keyse,A. Garrett-Reed, P.J. Goodhew, and G.W. Lorimer: An Introduction to Scanning Transmission Electron Microscopy, Springer/ BIOS Scientific Publishers, 1998.
5. P.M. Voyles, D.A. Mueller, J.L. Grazul, P.H. Citrin, and H.-J.L. Gossman: "Atomic Scaling Imaging of Individual Dopant Atoms and Clusters in Highly n-Type Bulk Silicon," Nature, 2002, 426, p. 826.
6. W. Vanderlinde: "STEM (Scanning Transmission Electron Microscopy) in a SEM," Proc. Int. Symp. Test. and Failure Analysis (ISTFA), 2002, p. 77.
7. P. Gnauck, U. Zelle, P. Hoffrogge, G. Benner, A. Orchowski, and W.-D. Rau: in Proc. Int. Symp. Tes., and Failure Analysis (ISTFA), 2003, p. 132.