SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 466, Issue 1-2, 2004, Pages 272-278

Adhesion improvement of electroless plated Ni layer by ultrasonic agitation during zincating process

(3) Jin, Jeong Gi a Lee, Sung Ki a Kim, Young Ho a

a Hanyang University (South Korea)

Author keywords

Adhesion; Electroless plating; Pull test; Scratch test; Ultrasonic agitation

Indexed keywords

ADHESION; ALUMINUM; DISSOLUTION; ELECTROPLATING; EVAPORATION; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; NUCLEATION; POLARIZATION; SIGNAL PROCESSING; ULTRASONICS;

PULL TEST; SCRATCH TEST; ULTRASONIC AGITATION; ZINCATING;

ELECTROLESS PLATING;

EID: 4544323557 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2004.02.100 Document Type: Article

Times cited : (54)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.