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Volumn 19, Issue 6-7, 1999, Pages 1067-1070

Hermetic glass sealing of AlN packages for high temperature applications

Author keywords

Corrosion; Glass; Joining; Nitrides.; Soldering

Indexed keywords

CORROSION; GLASS; HIGH TEMPERATURE APPLICATIONS; JOINING; LEAD COMPOUNDS; NITRIDES; PRESSURE EFFECTS; SOLDERING; STATISTICAL MECHANICS;

EID: 0032669056     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0955-2219(98)00375-6     Document Type: Article
Times cited : (13)

References (10)
  • 1
    • 4243341881 scopus 로고
    • Franckh'sche Verlagsbuchhandlung Stuttgart, 7. Aufl.
    • Neumüller, O.-A., Römpps Chemielexikon, Franckh'sche Verlagsbuchhandlung Stuttgart, 7. Aufl., 1977.
    • (1977) Römpps Chemielexikon
    • Neumüller, O.-A.1
  • 2
    • 0025795473 scopus 로고
    • Aluminium nitride for packaging high performance electronic circuits.
    • Gosey M.T., Lodge K.J., Logan E.A. Aluminium nitride for packaging high performance electronic circuits. GEC J. of Research. 8:(3):1991;137-144.
    • (1991) GEC J. of Research , vol.8 , Issue.3 , pp. 137-144
    • Gosey, M.T.1    Lodge, K.J.2    Logan, E.A.3
  • 3
    • 0008494258 scopus 로고
    • Modern substrate concepts for the microelectronic industry
    • ed. R. Waser. Augustinus Buchhandlung, Aachen
    • Roosen, A., Modern substrate concepts for the microelectronic industry. In Electroceramics IV, ed. R. Waser. Augustinus Buchhandlung, Aachen 1994, pp. 1089-1096.
    • (1994) In Electroceramics IV , pp. 1089-1096
    • Roosen, A.1
  • 5
    • 0042470884 scopus 로고
    • Solder glass processing
    • ed. D. R. Uhlmann and N. J. Kreidl. Academic Press, New York, Kap. 6.
    • SinghDeo, N. N. and Shukla, R. K., Solder glass processing. In Glass: Science and Technology, Vol. 2, ed. D. R. Uhlmann and N. J. Kreidl. Academic Press, New York, 1984, Kap. 6.
    • (1984) In Glass: Science and Technology , vol.2
    • Singhdeo, N.N.1    Shukla, R.K.2
  • 6
    • 0040716098 scopus 로고
    • Technological progress of a thick film resistor for aluminum nitride substrates with devitrifiable solder glass
    • 25-27, May
    • Kubota, T., Ishigame, L, Chiba, S. and Sekihara, S., Technological progress of a thick film resistor for aluminum nitride substrates with devitrifiable solder glass. IMC 1988 Proceedings, Tokyo, 25-27, May 1988.
    • (1988) IMC 1988 Proceedings, Tokyo
    • Kubota, T.1    Ishigame, L.2    Chiba, S.3    Sekihara, S.4
  • 7
    • 0025249411 scopus 로고
    • Thermodynamic considerations in the thick-film metallization of aluminium nitride substrates.
    • Norton M.G. Thermodynamic considerations in the thick-film metallization of aluminium nitride substrates. J. Mater. Sci. Letters. 9:1990;91-93.
    • (1990) J. Mater. Sci. Letters , vol.9 , pp. 91-93
    • Norton, M.G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.