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Volumn 19, Issue 6-7, 1999, Pages 1067-1070
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Hermetic glass sealing of AlN packages for high temperature applications
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Author keywords
Corrosion; Glass; Joining; Nitrides.; Soldering
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Indexed keywords
CORROSION;
GLASS;
HIGH TEMPERATURE APPLICATIONS;
JOINING;
LEAD COMPOUNDS;
NITRIDES;
PRESSURE EFFECTS;
SOLDERING;
STATISTICAL MECHANICS;
ALUMINIUM NITRIDE;
CHEMICAL COMPATIBILITY;
CRYSTALLIZING THREE COMPONENT GLASS;
GLASS SOLDERING;
HERMETIC GLASS SEALING;
THERMODYNAMIC CALCULATIONS;
ALUMINUM COMPOUNDS;
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EID: 0032669056
PISSN: 09552219
EISSN: None
Source Type: Journal
DOI: 10.1016/s0955-2219(98)00375-6 Document Type: Article |
Times cited : (13)
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References (10)
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