Chip-to-chip optoelectronics SOP on organic boards or packages

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 386-397

  Chang, Gee Kung ^a   Guidotti, Daniel ^a   Liu, Fuhan ^a   Chang, Yin Jung ^a   Huang, Zhaoran ^a   Sundaram, Venkatesh ^a   Balaraman, Devarajan ^a   Hegde, Shashikant ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION GRATINGS; HYBRID INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; LSI CIRCUITS; MIXER CIRCUITS; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; PHOTODETECTORS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING POLYMERS;

OPTICAL COMPONENTS; OPTICAL PLANAR WAVEGUIDES; RADIO FREQUENCY ELECTRONICS; SYSTEM-ON-PACKAGE;

CHIP SCALE PACKAGES;

EID: 4544255367     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.831880     Document Type: Article

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