Modular systems for sensor integration

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 194-198

  Klein, Matthias ^a   Oppermann, Hermann ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DATA REDUCTION; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; RELIABILITY; SENSORS; STANDARDIZATION; THREE DIMENSIONAL;

BALL GRID ARRAY; MODULAR SYSTEM; REFLOW SOLDERING; SENSOR PACKAGING; STENCIL PRINTING; THREE-DIMENSIONAL STACK; VERTICAL BUS STRUCTURE;

ELECTRONICS PACKAGING;

EID: 0036452882     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. J. Kloeser et al: "Low Cost Flip Chip Technologies Using Chemical Ni-Bumping and Solder Printing", ISHM 1996, Minneapolis, October 6-10, 1996, pp. 93ff.
2. M. Klein et al.: "Comparison of Planar and 3D MCM Technology", Proc. EIB conference, October 4.-5., 2000, München
3. A. Ostmann: "Ultra Thin Chips for Miniaturized Products", presentation Flip Chip & Chip Scale Europe 2002, 20-21. March 2002, Böblingen