A copper/polyimide fabrication process for fabricating high-inductance microinductor

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 2, 2007, Pages 123-127

  Gao, Xiao Yu ^a   Zhou, Yong ^a   Cao, Ying ^a   Lei, Chong ^a   Ding, Wen ^a   Choi, Hyung ^b   Won, Jonghwa ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b SAMSUNG Electronics   (South Korea)

Author keywords

High inductance; Magnetic core; Microinductor; Quality factor

Indexed keywords

FABRICATION PROCESS; HIGH INDUCTANCE; INSULATION MATERIALS; MICROINDUCTOR; QUALITY FACTOR; TECHNOLOGICAL PROCESS;

COREMAKING; MAGNETIC CIRCUITS; MAGNETIC CORES; MAGNETIC DEVICES; POLYIMIDES; POLYMERS; Q FACTOR MEASUREMENT;

INDUCTANCE;

EID: 45249092500     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.899134     Document Type: Article

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