Integrated electroplated micromachined magnetic devices using low temperature fabrication processes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 1, 2000, Pages 3-

  Park, Jae Y ^a   Allen, Mark G ^b  

^a LG   (South Korea)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

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EID: 33747817739     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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