Bondability of processed glass wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3825, Issue , 1999, Pages 53-62

  Pandraud, Gregory ^a   Gui, Cheng Qun ^a   Pigeon, Florent ^b   Lambeck, Paul V ^a   Parriaux, Olivier M ^b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b UNIVERSITÉ JEAN MONNET   (France)

Author keywords

borosilicate glass; Integrated optics; wafer direct bonding

Indexed keywords

BOROSILICATE GLASS; ELASTIC MODULI; GLASS BONDING; INTEGRATED OPTICS; INTERFACIAL ENERGY; SURFACE ROUGHNESS; SURFACE TOPOGRAPHY; VAN DER WAALS FORCES; WAVEGUIDES;

CONTINUOUS MODELING; RANDOM DISTRIBUTION; REAL AREA OF CONTACT; ROOT MEAN SQUARE ROUGHNESS; SPECIFIC SURFACE ENERGY; SURFACE ROUGHNESS MODEL; WAFER DIRECT BONDING; WAVEGUIDE TECHNOLOGY;

WAFER BONDING;

EID: 45149130439     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.364303     Document Type: Conference Paper

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