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Volumn 619-620, Issue 1-2, 2008, Pages 176-182

Optimisation of copper electrodeposition processes for Si technology based inductive microsystems

Author keywords

Coil devices; Copper microstructures; Electrodeposition; Stress; XRD

Indexed keywords

ELECTRODEPOSITION; MICROSTRUCTURE; OPTIMIZATION; STRESS MEASUREMENT; SUBSTRATES; X RAY DIFFRACTION;

EID: 45049085127     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2008.04.011     Document Type: Article
Times cited : (6)

References (17)
  • 16
    • 0003427458 scopus 로고
    • Addison-Wesley Publishing Company Inc. (Chapter 3: Measurement of residual stress)
    • Cullity B.D. Elements of X-ray Diffraction. second ed. (1978), Addison-Wesley Publishing Company Inc. (Chapter 3: Measurement of residual stress)
    • (1978) Elements of X-ray Diffraction. second ed.
    • Cullity, B.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.