Measuring the natural convective heat transfer coefficient at the surface of electronic components

Conference Record - IEEE Instrumentation and Measurement Technology Conference

Volumn 2, Issue , 2001, Pages 1045-1050

  Hanreich, G ^a   Nicolics, J ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Heat transfer coefficient; Natural convection

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; HEAT TRANSFER COEFFICIENTS; NATURAL CONVECTION; NUMERICAL METHODS; TEMPERATURE; THERMAL VARIABLES MEASUREMENT;

ELECTRONIC COMPONENTS; NATURAL CONVECTIVE HEAT TRANSFER COEFFICIENT;

ELECTRONIC EQUIPMENT;

EID: 0034822344     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Natural convection air cooling of electronic components in partially open compact horizontal enlosures
2. Correlating equations for laminar and turbulent free convection from a vertical plate
3. Wärmeübergang durch freie Konvektion an umströmten Körpern
4. Characteristics of a turbulent natural convection boundary layer along a vertical plate
5. Heat transfer and fluid flow of natural convection adjacent to upward-facing horizontal plates
6. Average nusselt number on the downward-facing heated plate
7. Three-dimensional natural convection in an enclosure with an internal isolated vertical plate
8. Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices
9. Comparison of the thermal performance of plastic-encapsulated and hermetically sealed packages
10. High resolution thermal simulation of electronic components
11. Wärmeübertragung
12. Handbook of heat transfer
13. Accepted practices for making microelectronic device thermal characteristics tests