SCOPUS 정보 검색 플랫폼

Materials Science and Engineering: A

Volumn 456, Issue 1-2, 2007, Pages 93-98

Effect of transient liquid phase diffusion bonding on microstructure and properties of a nickel base superalloy Rene 80

(3) Ekrami, A a Moeinifar, S a Kokabi, A H a

a SHARIF UNIVERSITY OF TECHNOLOGY (Iran)

Author keywords

High temperature alloy; Intermetallic compounds; Microstructure; Rene 80; Scanning electron microscopy; TLP bonding

Indexed keywords

BONDING; HARDNESS; HEAT TREATMENT; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; POROSITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SUPERALLOYS;

HIGH TEMPERATURE ALLOY; TRANSIENT LIQUID PHASE DIFFUSION BONDING;

NICKEL ALLOYS;

BONDING; HARDNESS; HEAT TREATMENT; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; POROSITY; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SUPERALLOYS;

EID: 33947414065 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2006.12.044 Document Type: Article

Times cited : (37)

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