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Volumn 406, Issue 1-2, 2005, Pages 319-327
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A comparison of microstructural developments in TLP diffusion bonds made using ODS Ni alloy
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Author keywords
Diffusion bond; Joint interface; Oxide dispersion strengthened alloy; Recrystallization; Transient liquid phase
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Indexed keywords
BOND STRENGTH (MATERIALS);
COMPOSITION EFFECTS;
CREEP;
CRYSTAL MICROSTRUCTURE;
DIFFUSION IN LIQUIDS;
HIGH TEMPERATURE PROPERTIES;
INTERFACES (COMPUTER);
METALLOGRAPHIC MICROSTRUCTURE;
RECRYSTALLIZATION (METALLURGY);
STRENGTHENING (METAL);
SUPERALLOYS;
YTTRIUM COMPOUNDS;
DIFFUSION BONDS;
JOINT INTERFACE;
MICROSTRUCTURAL DEVELOPMENTS;
OXIDE DISPERSION STRENGTHENED (ODS) SUPERALLOYS;
TRANSIENT LIQUID PHASE;
NICKEL ALLOYS;
NICKEL ALLOY;
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EID: 26944497858
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2005.07.002 Document Type: Article |
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Times cited : (18)
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References (9)
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