Microstructural comparison of material damage in GaAs caused by Berkovich and wedge nanoindentation and nanoscratching

Scripta Materialia

Volumn 59, Issue 3, 2008, Pages 364-367

  Parlinska Wojtan, M ^a   Wasmer, K ^a   Tharian, J ^a   Michler, J ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Deformation process; GaAs; Nanoindentation; Scratch

Indexed keywords

DEFORMATION; NANOINDENTATION; SEMICONDUCTING GALLIUM ARSENIDE; TRANSMISSION ELECTRON MICROSCOPY;

BERKOVICH INDENTER; SCRATCH;

MICROSTRUCTURE;

EID: 44549084594     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.04.008     Document Type: Article

References (36)

1. Warren P.D., Pirouz P., and Roberts S.G. Philos. Mag. A 50 (1984) L23
2. Lefebvre A., Androussi Y., and Vanderscheave G. Phys. Status Solidi A 99 (1987) 405
3. Leipner H.S., Lorenz D., Zeckzer A., Lei H., and Grau P. Physica B 308-310 (2001) 446
4. Le Bourhis E., and Patriarche G. Prog. Cryst. Growth Ch. 47 (2003) 1
5. Lawn B. Fracture of Brittle Solids. second ed. (1993), Cambridge University Press, Cambridge
6. Oliver W.C., and Pharr G.M. J. Mater. Res. 7 (1992) 1564
7. D. Scannell, D. Smith, Suss Report, 1987.
8. J.W. Ure, Suss Report, 1988.
9. Loomis Industries, .
10. Wasmer K., Ballif C., Gassilloud R., Pouvreau C., Rabe R., M Breguet J., Solleti J.M., Karimi A., Schulz D., and Michler J. Adv. Eng. Mater. 7 (2005) 309
11. Wasmer K., Ballif C., Pouvreau C., Schulz D., and Michler J. J. Mater. Process. Tech. 198 (2008) 114
12. Wasmer K., Ballif C., Pouvreau C., Schulz D., and Michler J. J. Mater. Process. Tech. 198 (2008) 105
13. Karimi A., Wang Y., Cselle T., and Morstein M. Thin Solid Film 420-421 (2002) 275
14. Xiaoyu J., Lauke B., and Schueller T. Thin Solid Films 414 (2002) 63
15. Jardret V., Zahouani H., Loubet J.L., and Mathia T.G. Wear 218 (1998) 8
16. Mann A.B., and Pethica J.B. Appl. Phys. Lett. 69 (1996) 907
17. Mann A.B., and Pethica J.B. Philos. Mag. A 79 (1999) 577
18. Patriarche G., and Le Bourhis E. Philos. Mag. A 82 (2002) 1953
19. Le Bourhis E., and Patriarche G. Philos. Mag. Lett. 83 (2003) 149
20. Bradby J.E., Williams J.S., Wong-Leung J., Swain M.V., and Munroe P. Appl. Phys. Lett. 78 (2001) 3235
21. Bradby J.E., Williams J.S., Wong-Leung J., and Kucheyev S.O. Philos. Mag. A 82 (2002) 1931
22. Bradby J.E., Williams J.S., and Swain M.V. J. Mater. Res. 19 (2004) 380
23. Choi S.K., Mihara M., and Nimomiya T. Jpn. J. Appl. Phys. 16 (1997) 737
24. Largeau L., Patriarche G., Glas F., and Le Bourhis E. J. Appl. Phys. 95 (2004) 3984
25. Levade C., and Vanderschaeve G. Phys. Status Solidi A 171 (1999) 83
26. Koubai{dotless}̈ti S., Levade C., Vanderschaeve G., and Couderc J.J. Philos. Mag. A 80 (2000) 83
27. Lefebvre A., and Vanderschaeve G. Phys. Status Solidi A 107 (1988) 647
28. Vanderschaeve G. Solid State Phenom. 59-60 (1998) 145
29. Lloyd S.J., Molina-Aldareguia J.M., and Clegg W.J. J. Mater. Res. 16 (2001) 3347
30. Lloyd S.J., Castellero A., Guliani F., Long Y., K McLaughlin K., Molina-Aldareguia J.M., Stelmashenko N.A., Vandeperre L.J., and Clegg W.J. Proc. R. Soc. A 461 (2005) 2521
31. F. Giuliani, S.J. LLoyd, L.J. Vandeperre, W.J. Clegg, in: S. McVitie, D. McCombe (Eds.), Proc EMAG, Oxford, 2003, p. 123.
32. K. Wasmer, M. Parlinska-Wojtan, R. Gassilloud, C. Pouvreau, J. Tharian, J. Michler, Appl. Phys. Lett. 90, paper ID: 031902, 2007.
33. George A., and Rabier J. Rev. Phys. Appl. 22 (1987) 941
34. Rabier J., and George A. Rev. Phys. Appl. 22 (1987) 1327
35. Sumitomo Electric Industries Ltd. Report No. EU-5R, 2005, unpublished.
36. Edington E.J.W. Practical Electron Microscopy in Materials Science (1976), Van Nostrand Reinhold, New York