Effects of discontinuities and technological fluctuations on the RF performance of BGA packages

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1769-1775

  Ndip, Ivan ^a   John, Werner ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND NETWORKS; CIRCUIT THEORY; COSTS; ELECTRIC DISTORTION; ELECTROMAGNETIC FIELDS; MICROPROCESSOR CHIPS; MICROWAVE POWER TRANSMISSION; PRINTED CIRCUIT BOARDS; ROBUSTNESS (CONTROL SYSTEMS);

BALL GRID ARRAY (BGA); RADIO FREQUENCY (RF); SIGANL INTEGRITY (SI); WIDEBAND PACKAGES;

NATURAL FREQUENCIES;

EID: 24644519549     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Caggiano, M.F., Barkley, E., Sun, M., Kleban, J.T.,; "Electrical Modeling of the chip scale ball grid array package at radio frequencies", Elsevier Microelectronics Journal 31, 2000, Page(s) 701-709.
2. Hamano, T., Ikemoto, Y., "Electrical characterization of a 500 MHz frequency EBGA package", IEEE Transactions on Advanced Packaging Volume: 24, Issue: 4, Nov. 2001, Pages: 534-541.
3. Yong Kee Yeo, Iyer M.K., Youlin Qiu, Mook Seng Leong, Ban Leong Ooi, "High frequency characterization of a chip scale BGA package", Asia Pacific Microwave Conference, Volume: 3, Nov. 30-Dec. 3, 1999, Pages: 966-970.
4. Caggiano, M.F., Bulumulla S., Lischner D., "RF electrical measurements of fine pitch BGA packages", 50th Electronic Components and Technology Conference, 21-24 May 2000, Pages: 449-453.
5. Jaeyong Jeong, Seungki Nam, Shin Y.S., Kim Y.S., Jichai Jeong, "Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz", IEEE Transactions on Advanced Packaging, Volume: 22, Issue: 3, Aug. 1999, Pages: 343-347.
6. Mattei, C., Agrawal A.P., "Electrical characterization of BGA packages", 47th Electronic Components and Technology Conference, 18-21 May 1997, Pages: 1087-1093.
7. Solomon, D., Del Rosario E., Opiniano E., Jackson Wong, Pinello W., "Electrical characterization of metal enhanced BGA packages", 49th Electronic Components and Technology Conference, 1-4 June 1999, Pages: 848-852.
8. Ndip, I., Sommer, G., John, W., Reichl, H., "Methodology for Efficient Modeling of BGA Packages at RF/Microwave Frequencies", 37th International Symposium on Microelectronics (IMAPS 2004), Long Beach, CA, U.S.A, November 16-20, 2004.