Pulse reverse plating of Ni-Co alloys: Deposition kinetics of Watts, sulfamate and chloride electrolytes

Electrochimica Acta

Volumn 52, Issue 3, 2006, Pages 1145-1151

  Hansal, Wolfgang E G ^a,c   Tury, Barbara ^b   Halmdienst, Martina ^a,c   Varsányi, Magda Lakatos ^b   Kautek, Wolfgang ^c  

^a Happy Plating GmbH   (Austria)

^b BAY ZOLTÁN NONPROFIT LTD FOR APPLIED RESEARCH   (Hungary)

^c UNIVERSITY OF VIENNA   (Austria)

Author keywords

Nickel cobalt; Passivation; Polarisation; Pulse reverse deposition; XRF

Indexed keywords

ELECTROCHEMICAL PROPERTIES; GALVANIC DEPOSITION; PULSE REVERSE DEPOSITION; SULFAMATE;

COBALT ALLOYS; CURRENT DENSITY; DEPOSITION; ELECTROCHEMISTRY; ELECTROLYTES; ELECTROLYTIC CELLS; FLUORESCENCE; PASSIVATION; POLARIZATION; REACTION KINETICS; X RAY ANALYSIS;

NICKEL ALLOYS;

EID: 33749535036     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2006.07.012     Document Type: Article

References (22)

1. Smith W.F. Foundations of Material Science and Engineering (1993), McGraw-Hill Inc. p. 502
2. Callister Jr. W.D. Material Science and Engineering, An Introduction (1994), John Wiley and Sons, Inc., New York p. 677
3. Landolt D., and Marlot A. Surf. Coat. Technol. 169-170 (2003) 8
4. Fenineche N.E., Hamzaoui R., and El Kedim O. Mater. Lett. 57 (2003) 4165
5. Ferre R., Ounadjela K., George J.M., Piraux L., and Dubois S. Phys. Rev. B56 (1997) 21
6. Shacham-Diamand Y., and Sverdlov Y. Microelectron. Eng. 50 (2000) 525
7. Lupi C., and Pilone D. Miner. Eng. 14 (2001) 1403
8. Tang P. Electrochim. Acta 47 (2001) 61
9. Chang L.M., An M.z., and Shi S.y. Mater. Chem. Phys. 94 (2005) 125
10. Puippe J.C., and Leaman F. Theory and Practise of Pulse Plating (1986), American Electroplaters and Surface Finishers Soc. p. 20
11. Correia A.N., and Machado S.A.S. J. Appl. Electrochem. 33 (2003) 367
12. Correia A.N., and Machado S.A.S. Electrochim. Acta 45 (2000) 1733
13. Brenner A. Electrodeposition of Alloys Principles and Practise (1963), Academic Press, London p. 87
14. Bai A., and Hu C.-C. Electrochim. Acta 47 (2002) 3447
15. Zech N., Podlaha E.J., and Landolt D. J. Appl. Electrochem. 28 (1998) 1251
16. Golodnitsky D., Rosenberg Y., and Ulus A. Electrocim. Acta 47 (2002) 2707
17. Golodnitsky D., Gudin N.V., and Volyanuk G.A. J. Electrochem. Soc. 147 (2000) 4156
18. Lupi C., and Pilone D. Waste Manage. 22 (2002) 871
19. Burzinska L., and Rudnik E. Hydrometallurgy 54 (2002) 133
20. Tury B., Lakatos Varsanyi M., and Roy S. Surf. Coat. Technol. 200 (2006) 6713
21. Lowenheim F.A. Electroplating (1995), Technical Reference Publications Ltd. p. 372
22. Gomez E., Pane S., and Valles E. Electrochim. Acta 51 (2005) 146