Thermal cycling reliability of lead free solders for automotive applications

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 350-357

  Suhling, Jeffrey C ^a   Gale, H S ^a   Johnson, R Wayne ^a   Islam, M Nokibul ^a   Shete, Tushar ^a   Lall, Pradeep ^a   Bozack, Michael J ^a   Evans, John L ^a   Seto, Ping ^b   Gupta, Tarun ^b   Thompson, James R ^b  

^a AUBURN UNIVERSITY   (United States)

^b DAIMLER AG   (Germany)

Author keywords

Chip resistor; Intermetallics; Lead free; Microstructure; Reliability; Solder joints; Weibull plot

Indexed keywords

AUTOMOTIVE APPLICATIONS; LEAD FREE SOLDERS; THERMAL CYCLING RELIABILITY;

AEROSPACE APPLICATIONS; AUTOMOTIVE ENGINEERING; CERAMIC PRODUCTS; COPPER ALLOYS; ELECTRIC POTENTIAL; LAMINATES; LEAD ALLOYS; MICROPROCESSOR CHIPS; RELIABILITY; RESISTORS; SILVER ALLOYS; THERMAL CYCLING; THERMAL EXPANSION;

SOLDERING ALLOYS;

EID: 4444380026     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Lau, J. H., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., Love, D., Menis, I. and Sullivan, B. "Reliability testing and data analysis of high-density packages' lead-free solder joints," Proceedings of APEX 2003, Paper S42-3, pp. 1-24, Anaheim, CA, 2003.
2. Farooq, M., Goldmann, L., Martin, G., Goldsmith, C. and Bergeron, C., "Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling," Proceedings of the 53rd IEEE Electronic Components and Technology Conference, pp. 827-833, New Orleans, LA, May 28-30, 2003.
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5. Stam, F. A., and Davitt, E., "Effects of Thermomechanical Cycling on Lead and Lead-Free (SnPb and SnAgCu) Surface Mount Solder Joints," Microelectronics Reliability, Vol. 41, pp. 1815-1822, 2001.
6. nd Electronic Components and Technology Conference, San Diego, CA, May 28-31, 2002.
7. Sayama, T., Takayanagi, T., Nagai, Y., Mori, T., and Yu, Q., "Evaluation of Microstructural Evolution and Thermal Fatigue Crack Initiation in Sn-Ag-Cu Solder Joints," Proceedings of InterPACK '03, Paper Number IPACK2003-35096, pp.1-8, Lahaina, HI, July 6-11, 2003.