Performance analysis of double stack cold plates covering all conditions of asymmetric heat loading

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 3, 1998, Pages 296-301

  Pieper, R J ^a   Kraus, A D ^a  

^a Naval Postgraduate School   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; FORCED CONVECTION; HEAT LOSSES; NUMERICAL ANALYSIS; PERFORMANCE; THERMAL LOAD;

STACK COLD PLATES;

ELECTRONICS PACKAGING;

EID: 0032163117     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792636     Document Type: Article

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