Circuit modeling to predict the performance of force-cooled cold plate structures

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn 6, Issue , 1999, Pages

  Pieper, Ronald J ^a   Michael, Sherif ^a  

^a NAVAL POSTGRADUATE SCHOOL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISTRIBUTED LOSSY TRANSMISSION LINE PARAMETERS; SOFTWARE PACKAGED PSPICE;

COMPUTER SIMULATION; HEAT LOSSES; HEAT TRANSFER; TRANSMISSION LINE THEORY;

ELECTRIC NETWORK ANALYSIS;

EID: 0032633636     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

1. D. Q. Kern and A. D. Kraus, Extended Surface Heat Transfer, McGraw-Hill, New York, 1972.
2. N. V. Suryanarayana, "Transient Response of Straight Fins," J. Heat Transfer, pp. 417-421, Aug. 1975.
3. N. V. Suryanarayana, "Transient Response of Straight Fins, Part II," Trans. ASME, PP. 324-326, May 1976.
4. Goldman, S (1949) Transformation Calculus and Electrical Transrents Prentice Hall
5. Pieper, R J and Kraus, A D, "Performance Analysis of Double Stack Cold Plates Covering All Regimes of Asymmetric Heat Loading," ASME Journal of Electronic Packaging, Vol 120, pp 296-300, September 1998
6. Ron J. Pieper and Allan D. Kraus, "A Two- Port Model for Transient Analysis of Heat Transfer in Fin Arrays," IEEE 29th Southeastern Symposium on System Theory, pp. 348-352, Mar. 1997.
7. Horowitz, P, and Hill, W (1981). The Art of Electronics, Chap. 5: Voltage Regulators and Power Circuits, Cambridge University Press, Cambridge.
8. PSPICE, Version 7.1, MicroSim Corp., Irving, CA, 1996.