PBGA reliability study for automotive applications

SAE Technical Papers

Volumn , Issue , 1998, Pages

  Adams, Rickie M ^a   Glovatsky, Andrew ^a   Lindley, Theresa ^b   Evans, John L ^c   Mawer, Andrew ^d  

^a VISTEON CORPORATION   (United States)

^b DELPHI CORPORATION   (United States)

^c CENTRO RICERCHE FIAT   (Italy)

^d MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS PACKAGING; SOLDERED JOINTS;

AUTOMOTIVE APPLICATIONS; COMMERCIAL APPLICATIONS; DESIGN ENHANCEMENT; PACKAGE INTEGRITY; PLASTIC BALL GRID ARRAYS; SOLDER JOINT RELIABILITY; TEMPERATURE CYCLING; VISTEON AUTOMOTIVE SYSTEMS;

AUTOMOBILES;

EID: 85072463224     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/980341     Document Type: Conference Paper

References (5)

1. Lindley, Theresa, BGA Solder Joint Reliability Study for Automotive Electronics, Delco Electronics, Kokomo, IN 46904
2. Lau, J.H., and Pao Y.-H., Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, MCGraw-Hill, New York, NY, 1997.
3. IPC-SM-785, Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
4. Abernethy R., Weibull Analysis Handbook, Second Printing, October 1995
5. Darveaux R., and Mawer A., Thermal and Power Cycling Limits of PBGA Assemblies, 1995 Surface Mount International Proceedings, pp. 315-326