Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 118-124

  Mawer, Andrew ^a   Vo, Nick ^a   Johnson, Zane ^a   Lindsay, Wayne ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT TESTING; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING;

AUTOMOTIVE UNDER HOOD; ELECTRONIC TRANSMISSION CONTROLLERS; PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0032681036     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)