Analysis of an MCM implementation for an automotive controller

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 3, 1997, Pages 325-332

  Newberry, Robert ^a,c,d   Bosley, Larry ^a,e,f,g   Evans, John ^{a,f,h,i,j,k,l,m}   Johnson, R Wayne ^b,f,n,o,p,q  

^a CENTRO RICERCHE FIAT   (Italy)

^b AUBURN UNIVERSITY   (United States)

^c MCM PBGA Programs   (United States)

^d UNIVERSITY OF ALABAMA   (United States)

^e UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

^f AUBURN UNIVERSITY   (United States)

^g Adv Technology Planning Department   (United States)

^h UNIVERSITY OF ALABAMA IN HUNTSVILLE   (United States)

ⁱ Chrysler Huntsville Electronics   (United States)

^j Chrysler Business Group

^k Adv Technol Plan Grp at Chrysler

^l Adv Packaging and Systems Analysis

^m Advanced Technology Planning Group   (United States)

ⁿ IEEE   (United States)

^o CPMT Society   (United States)

^p Intl Soc for Hybrid Microelectron   (United States)

^q VANDERBILT UNIVERSITY   (United States)

more..

Author keywords

Flex Interconnect; Multichip Modules; Plastic Ball Grid Array

Indexed keywords

EID: 0011926807     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. J. L. Evans, L. E. Bosley and R. W. Johnson, "MCM-Technology: A Systems Cost Analysis for a High-Volume Automotive Electronics Application," IEEE Transactions on Components, Packaging, and Manufacturing Technology, (CPMT), Part B: Advanced Packaging, Vol. 18, No. 1, February 1995.
2. W. E. Bernier, "BGA vs. QFP: A Summary of Tradeoffs for Selection of High I/O Components," Proceedings of 1994 SMI Conference, August 1994.
3. A. Holliday, et al., "Designed Experiment to Evaluate Assembly Defect Drivers for PBGA Packages," Proceedings of 1995 SMI Conference, San Jose, California, August 1995.
4. L. E. Bosley, K. P. Slattery, D. Canestrari, and J. Trent "Multichip Modules: Analysis of EMI Effects by MCM Implementation Versus Single-Chip Package Approach," The ISHM International Journal of Microcircuits and Electronics Packaging, Vol. 18, No. 4, Fourth Quarter, pp. 350-356, 1995.
5. M. Lankford, K. Davis, R. W. Johnson, M. E. Baginski, and H. Hontgas, "Investigation of Design and Performance of Multichip Modules Including Electromagnetic Compatibility," Proceedings of the 1997 International Conference on Multichip Modules, (MCM), Denver, Colorado, pp. 187-192, April 2-4, 1997.
6. R. W. Johnson, R. W. Knight, J. C. Suhling, D. Maslyk, M. Palmer, and John. L. Evans, "Thermo-Mechanical Analysis of Metal Backed Substrates" Submitted for Publication, 1997.
7. Andrew Mawer, et al, to be published in 1997 Surface Mount International Proceedings of Technical program, San Jose, California, September 1997.