Thermal performance of a power electronics module made by thick-film planar interconnection of power devices

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 1097-1101

  Wen, S S ^a   Liang, Zhenxian ^a   Lee, F C ^a   Lu, Guo Quan ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Dielectric substrates; Dielectric thin films; Electronic packaging thermal management; Modular construction; Multichip modules; Nonhomogeneous media; Polymer films; Power electronics; Semiconductor device noise; Thermal management

Indexed keywords

CHIP SCALE PACKAGES; DEPOSITION; ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING; FILM PREPARATION; MODULAR CONSTRUCTION; MULTICHIP MODULES; MULTILAYER FILMS; MULTILAYERS; POLYMER FILMS; POWER ELECTRONICS; SEMICONDUCTOR DEVICES; SUBSTRATES; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; THERMOCOUPLES; THICK FILM DEVICES; THICK FILMS; THIN FILMS;

DIELECTRIC SUBSTRATES; DIELECTRIC THIN FILMS; ELECTRONIC PACKAGING THERMAL MANAGEMENTS; NONHOMOGENEOUS MEDIA; SEMICONDUCTOR DEVICE NOISE;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 0242704201     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012580     Document Type: Conference Paper

References (6)

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