Integrated packaging of a 1kW switching module using planar interconnect on embedded power chips technology

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 2003, Pages 42-47

  Liang, Z X ^a   Lee, F C ^a   Van Wyk, J D ^a   Boroyevich, D ^a   Scott, E ^a   Chen, J ^a   Lu, B ^a   Pang, Y ^a  

^a VIRGINIA STATE UNIVERSITY   (United States)

Author keywords

Multi chip Integration; Planar Process; Power Electronics Assemblies (Modules); Power Electronics Integrated Packaging

Indexed keywords

ELECTRIC CONVERTERS; ELECTRONICS PACKAGING; MAXWELL EQUATIONS; MOSFET DEVICES; SWITCHING; THIN FILMS;

EMBEDDED POWER CHIPS;

POWER ELECTRONICS;

EID: 0037233076     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2003.1179174     Document Type: Conference Paper

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