Pulse plating of Ni-W alloys from model electrolytes

Transactions of the Institute of Metal Finishing

Volumn 86, Issue 2, 2008, Pages 92-97

  Franz, S ^a   Marlot, A ^b   Cavallotti, P L ^a   Landolt, D ^b  

^a POLITECNICO DI MILANO   (Italy)

^b EPFL   (Switzerland)

Author keywords

Induced co deposition; Nickel tungsten alloys; Pulse plating

Indexed keywords

AMMONIA; CONCENTRATION (PROCESS); ELECTROLYTES; PLATING;

INDUCED CO-DEPOSITION; NICKEL-TUNGSTEN ALLOYS; PULSE PLATING;

NICKEL ALLOYS;

EID: 44349105318     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1179/174591908X272951     Document Type: Article

References (23)

1. G. Raitschevski, N. Boschkov, A. Sofianska and N. Atanassov: Galvanotechnik, 1997, 88, 1153-1157.
2. M. Donten, H. Cesiulis and Z. Stojek: Electrochim. Acta, 2000, 45, 3389-3396.
3. C.-H. Huang, W. Y. She and H. M. Wu: Plat. Surf Finish., 1999, 86, 79-83.
4. H. Somekawa, T. G. Nieh and K. Higashi: Scr. Mater., 2004, 50, 1361-1365.
5. H. Capel, P. H. Shipway and S. J. Harris: Wear, 2003, 255, 917-923.
6. A. Kohn, M. Eizenberg, Y. Shacham-Diamand, B. Israel and Y. Sverdlov: Microelectr. Eng., 2001, 55, 297-303.
7. N. Du and M. Pritzker: J. Appl. Electrochem., 2003, 33, 1001-1009.
8. A. Brenner: 'Electrodepositon of alloys', Vols. I and II; 1963, New York, Academic Press.
9. O. Younes and E. Gileadi: Electrochem. Solid State Lett., 2000, 3, 543-545.
10. O. Younes and. E. Gileadi: J. Electrochem. Soc., 2002, 149, C100-C111.
11. O. Younes-Metzler, L. Zhu and E. Gileadi: Electrochim. Acta, 2003, 48, 2551-2562.
12. E. J. Podlaha and D. Landolt: J. Electrochem. Soc., 1996, 143, 893-899.
13. E. J. Podlaha and D. Landolt: J. Electrochem. Soc., 1996, 143, 885-892.
14. E. J. Podlaha and D. Landolt: J. Electrochem. Soc., 1997, 144, 1672-1680.
15. H. Ahlqvist: 'Electrodeposition of cobalt and nickel with tungsten and phosphorus - modeling and diffusion barrier properties', PhD thesis, No. 2813, EPFL, Lausanne, Switzerland, 2003.
16. J.-C. Puippe and F. Leaman (eds.): 'Theory and practice of pulse plating', 247; 1986, Orlando, FL, American Electroplaters Society.
17. A. Ruffoni and D. Landolt: Electrochim. Acta, 1994, 33, 1273-1279.
18. S. Roy, M. Matlosz and D. Landolt: J. Electrochem. Soc., 1994, 141, 1509-1517.
19. A. Marlot, P. Kern and D. Landolt: Electrochim. Acta, 2002, 48, 29-36.
20. M. Donten and Z. Stojek: J. Appl. Electrochem., 1996, 26, 665-672.
21. M. D. Obradovic, G. Z. Bosnjakov, R. M. Stevanovic, T. M. D. Maksimovic and A. R. Despic: Surf. Coat. Technol., 2006, 200, 4201-4207.
22. T. A. Rosebrugh and W. L Miller: J. Phys. Chem., 1916, 14, 816-833.
23. H. Y. Cheh: J. Electrochem. Soc., 1971, 118, 551-557.