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Volumn 86, Issue 12, 1999, Pages 79-83

Study of Stress Reducers in Nickel-Tungsten Electroforming Baths

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0008467212     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (18)

References (14)
  • 5
    • 0004195337 scopus 로고
    • McGraw-Hill Book Co., New York, NY.
    • F.A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, NY. 1978; p. 217.
    • (1978) Electroplating , pp. 217
    • Lowenheim, F.A.1
  • 12
    • 0004219668 scopus 로고
    • Harper Collins College Publishers, New York, NY
    • J. E. Huheey et al., Inorganic Chemistry, Harper Collins College Publishers, New York, NY, 1993; p. 378.
    • (1993) Inorganic Chemistry , pp. 378
    • Huheey, J.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.