Pulse electroplating of rich-in-tungsten thin layers of amorphous Co-W alloys

Journal of Applied Electrochemistry

Volumn 26, Issue 6, 1996, Pages 665-672

  Donten, M ^a   Stojek, Z ^a  

^a UNIVERSITY OF WARSAW   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMORPHOUS ALLOYS; COBALT; CORROSION RESISTANCE; CURRENT DENSITY; DUCTILITY; HARDNESS; OXIDATION; THIN FILMS; TUNGSTEN; X RAY DIFFRACTION;

PLATING BATH; PULSE ELECTROPLATING; PULSED CURRENT; SELECTIVE OXIDATION; SMOOTHNESS;

ELECTROPLATING;

EID: 0030166509     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00253466     Document Type: Article

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