Investigation of electroless plating of Ni-W-P alloy films

Journal of Applied Electrochemistry

Volumn 33, Issue 11, 2003, Pages 1001-1009

  Du, N ^a   Pritzker, M ^b  

^a NANCHANG HANGKONG UNIVERSITY   (China)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Electroless; Hypophosphite; Nickel tungsten phosphorous alloy

Indexed keywords

ADDITIVES; AGENTS; AMMONIUM COMPOUNDS; ANODIC POLARIZATION; COATINGS; ELECTROLESS PLATING; NICKEL COMPOUNDS; PH EFFECTS; REDUCTION; SODIUM COMPOUNDS; SOLUTIONS; THERMAL EFFECTS;

AMMONIUM SULFATE; HYPOPHOSPHITE; NICKEL SULFATE; NICKEL-TUNGSTEN-PHOSPHORUS ALLOY; SODIUM CITRATE; SODIUM TUNGSTATE;

NICKEL ALLOYS;

EID: 0344465281     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026231532006     Document Type: Article

References (32)

1. G.O. Mallory and J.B. Hajdu, 'Electroless plating: Fundamentals and Applications', (AESF, Orlando, FL, 1990).
2. Y. Okinaka and T. Osaka, in H. Gerischer and C.W. Tobias (Eds), 'Advances in Electrochemical Science and Engineering', Vol. 3, (VCH, Weinheim/New York, 1994), p. 55.
3. N. Takano, N. Hosoda, T. Yamada and T. Osaka, Electrochim. Acta 44 (1999) 3743.
4. S. Zhang, J. De Baets, M. Vereeken, A. Vervaet and A. Van Calster, J. Electrochem. Soc. 146 (1999) 2870.
5. T. Osaka, T. Misato, J. Sato, H. Akiya, T. Homma, M. Kato, Y. Okinaka and O. Yoshioka, J. Electrochem. Soc. 147 (2000) 1059.
6. S.Z. Chu, M. Sakairi, H. Takahashi, K. Simamura and Y. Abe, J. Electrochem. Soc. 147 (2000) 2181.
7. T. Homma, Y. Kita and T. Osaka, J. Electrochem. Soc. 147 (2000) 4138.
8. M.C. Zhang, E.T. Kang, K.G. Neoh and K.L. Tan, J. Electrochem. Soc. 148 (2001) C71.
9. Á Révész, J. Lendvai, J. Lóránth, J. Pádár and I. Bakonyi, J. Electrochem. Soc. 148 (2001) C715.
10. F.P. Perlstein, R.F. Weightman and R. Wick, Met. Fin. 61 (1963) 77.
11. Y.-S. Kim, S. Lopatin and Y. Shacham-Diamand, in Proceedings of the 1997 IEEE/Cornell Conference on 'Advanced Concepts in High Speed Semiconductor Devices and Circuits', 4-6, Aug. 1997, Ithaca, NY (1997), pp. 192-200.
12. Y. Shacham-Diamand, Y. Sverdlov and N. Petrov, J. Electrochem. Soc. 148 (2001) C162.
13. L.M. Abrantes and J.P. Correia, J. Electrochem. Soc. 141 (1994) 2356.
14. Y.-S. Kim and H.-J. Sohn, J. Electrochem. Soc. 143 (1996) 505.
15. M. Ebn Touhami, M. Cherkaoui, A. Srhiri, A. Ben Bachir and E. Chaissaing, J. Appl. Electrochem. 26 (1996) 487.
16. M. Ebn Touhami, E. Chaissaing and M. Cherkaoui, Electrochim. Acta 43 (1998) 1721.
17. L.M. Abrantes and M.C. Oliveira, Electrochim. Acta 41 (1996) 1703.
18. N. Petrov, Y. Sverdlov and Y. Shacham-Diamand, J. Electrochem. Soc. 149 (2002) C187.
19. K.M. Gorbunova, M.V. Ivanov and V.P. Moiseev, J. Electrochem. Soc. 120 (1973) 613.
20. Z. Jusys, J. Liaukonis and A. Vaškelis, J. Electroanal. Chem. 325 (1992) 247.
21. I. Genutiene, J. Lenkaitiene, Z. Jusys and A. Luneckas, J. Appl. Electrochem. 26 (1996) 118.
22. W. Blum and G. Hogaboom, 'Principles of Electroplating and Electroforming (Electrotyping)', 3rd edn. (McGraw-Hill, New York, 1949), p. 349.
23. F.A. Lowenheim, 'Electroplating', (McGraw-Hill, New York, 1978), p. 142.
24. A. Brenner, 'Electrodeposition of Alloys, Principles and Practices', Vol. 2 (Academic Press, New York, 1963), p. 457.
25. L.M. Abrantes, M.C. Oliveira, J.P. Correia, A. Bewick and M. Kalaji, J. Chem. Soc., Faraday Trans. 93 (1997) 1119.
26. E.J. Podlaha and D. Landolt, J. Electrochem. Soc. 144 (1997) 1672.
27. I. Ohno, Mater. Sci. Eng. A146 (1991) 33.
28. L.D. Burke and B.H. Lee, J. Appl. Electrochem. 22 (1992) 48.
29. R. Stevanovic, J. Stevanovic and A. Despic, J. Appl. Electrochem. 31 (2001) 855.
30. A.H. Gafin and S.W. Orchard, J. Appl. Electrochem. 22 (1992) 830.
31. T. Homma, I. Komatsu, A. Tamaki, H. Nakai and T. Osaka, Electrochim. Acta 47 (2001) 47.
32. C. Wagner and W Traud, Z. Elektrochem. 44 (1938) 391.