Reactive etching of platinum-manganese using a pulse-time-modulated chlorine plasma and a H2 plasma post-etch corrosion treatment

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 4, 2004, Pages 1093-1100

  Kumagai, Shinya ^a   Shiraiwa, Toshiaki ^b   Samukawa, Seiji ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUOUS WAVE PLASMA; CORROSION TREATMENT; ETCHING RATES; FLOW RATES;

ANISOTROPY; CONTINUOUS WAVE LASERS; CORROSION; DENSITY (SPECIFIC GRAVITY); DIFFUSION; ELECTRON CYCLOTRON RESONANCE; HYDROGEN; PLASMA ETCHING; PLASMA THEORY; PULSE TIME MODULATION; SCANNING ELECTRON MICROSCOPY; SILICA; THIN FILMS;

PLATINUM COMPOUNDS;

EID: 4344695135     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1738656     Document Type: Article

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