Adhesion studies of low-k silsesquioxane

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 297-301

  Cheng, Yao Yi ^a   Kan, Jiuq Yi ^a   Lin, I Shun ^a  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Adhesion strength; Low k; Plasma; Silsesquioxane

Indexed keywords

ADHESION STRENGTH; LOW-K; SILSEQUIOXANE; SUB-MICRO DEVICES;

ADHESION; CAPACITANCE MEASUREMENT; CHEMICAL MECHANICAL POLISHING; ELECTRIC WIRE; INTEGRATED CIRCUITS; LEAKAGE CURRENTS; PERMITTIVITY; SIGNAL PROCESSING; SURFACE ROUGHNESS;

DIELECTRIC MATERIALS;

EID: 4344687531     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.085     Document Type: Article

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