Bonding structures of silicon oxynitride prepared by oxidation of Si-rich silicon nitride

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 42-45

  Poon, M C ^a   Kok, C W ^a   Wong, H ^b   Chan, P J ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Bonding structure; Interface; Silicon oxynitride

Indexed keywords

BONDING STRUCTURE; RANDOM MIXTURES; SILICON OXYNITRIDE; THERMAL OXIDATION;

BINDING ENERGY; BONDING; CHEMICAL VAPOR DEPOSITION; HEAT TREATMENT; HYDROGEN; INTERFACES (MATERIALS); NITRIDES; OXIDATION; PERMITTIVITY; SILICON; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 4344625979     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.043     Document Type: Article

References (18)

1. Iwai H., Ohmi S. Microelectron. Reliab. 42:2002;465.
2. Wong H., Gritsenko V.A. Microelectron. Reliab. 42:2002;597.
3. Green M.L., Gusev E.P., Degraeve R., Garfunkel E.L. J. Appl. Phys. 90:2001;2057.
4. Wong H., Yang B.L., Cheng Y.C. Appl. Surf. Sci. 72:1993;49.
5. Wong H., Cheng Y.C. J. Appl. Phys. 74:1993;7364.
6. Lu Z.H., Tay S.P., Cao R., Pianetta P. Appl. Phys. Lett. 67:1995;2836.
7. Lu H.C., Gusev E.P., Gustaffson T., Garfunkel E., Green M.L., Brasen D., Feldman L.C. Appl. Phys. Lett. 69:1996;2713.
8. Carr E.C., Buhrman R.A. Appl. Phys. Lett. 63:1993;54.
9. Green M.L., Brasen D., Evans-Lutterodt K.W., Feldman L.C., Krisch K., Lennard W., Tang H.T., Manchanda L., Tang M.T. Appl. Phys. Lett. 65:1994;848.
10. Bhat M., Yoon G.W., Kim J., Kwong D.L., Arendt M., White J.M. Appl. Phys. Lett. 64:1994;2116.
11. Cerefolini G.F., Camalleri M., Galati C., Lorenti S., Renna L., Viscuso O., Condorelli G.G., Fragila I.L. Appl. Phys. Lett. 79:2001;2378.
12. Gritsenko V.A., Shaposhnikov A.V., Kwok W.M., Wong H. Thin Solid Films. 437:2003;135.
13. Gritsenko V.A., Wong H., Kwok R.W.M., Xu J.B. J. Vac. Sci. Technol., B. 21:2003;241.
14. Wong H., Poon M.C., Gao Y., Kok T.C.W. J. Electrochem. Soc. 148:2001;G275.
15. Chan J., Wong H., Poon M.C., Kok C.W. Microelectron. Reliab. 43:2003;611.
16. Gritsenko V.A., Kwok R.W.M., Wong H., Xu J.B. J. Non-Crsyt. Solids. 297:2002;91.
17. Wong H., Poon M.C., Kok C.W., Chan P.J., Gritsenko V.A. IEEE Trans. Electron Devices. 50:2003;1941.
18. Lucovsky G., Wu Y., Niimi H., Misra V., Philips J.C. Appl. Phys. Lett. 74:1999;2005.