Early resistance change and stress/electromigration modeling in aluminum interconnects

Microelectronics Reliability

Volumn 37, Issue 10-11, 1997, Pages 1491-1494

  Petrescu, V ^a   Mouthaan, A J ^a   Schoenmaker, W ^b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; ELECTRIC WIRE; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; POLYCRYSTALLINE MATERIALS;

ALUMINUM INTERCONNECTS; COMPRESSIVE STRESSES;

ELECTROMIGRATION;

EID: 0031250105     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(97)00093-0     Document Type: Article

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