Rheological techniques for measuring normal stress differences of solder pastes

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 178-183

  Riedlin, M H A ^a   Ekere, N N ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; GONIOMETERS; MEASUREMENT ERRORS; RHEOLOGY; RHEOMETERS; SHEAR STRESS; SOLDERING ALLOYS; STRAIN MEASUREMENT; STRESS ANALYSIS; SUSPENSIONS (FLUIDS);

NORMAL STRESS DIFFERENCES MEASUREMENTS; RHEOGONIOMETERS; SOLDER PASTES;

SOLDERING;

EID: 0031373365     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)