Spectroscopic ellipsometry-based scatterometry for depth and line width measurements of polysilicon-filled deep trenches

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5375, Issue PART 1, 2004, Pages 587-596

  Hingst, Thomas ^a   Moert, Manfred ^a   Reinig, Peter ^a   Backen, Elke ^a   Dost, René ^a   Weidner, Peter ^a   Hopkins, John ^b   Dziura, Ted ^b   Elazami, Assim ^b   Freed, Regina ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

Depth control; DRAM; Polysilicon recess; Scatterometry; Spectroscopic ellipsometry

Indexed keywords

DEPTH CONTROL; POLYSILICON RECESS; SCATTEROMETRY;

ATOMIC FORCE MICROSCOPY; DYNAMIC RANDOM ACCESS STORAGE; ELLIPSOMETRY; ETCHING; MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY; SCATTERING;

POLYSILICON;

EID: 4344587473     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.535646     Document Type: Conference Paper

References (8)

1. U. Mantz, P. Weidner, P. Guittet, J. Stehle, S. Bourtault, D. Zahorski, "Infrared spectroscopic ellipsometry in semiconductor manufacturing", to be published in Proceedings of SPIE Vol. 5375, 2004.
2. S.H. Zaidi, G. Stojakovic, A. Gutmann, C. Bozdog, U. Mantz, S. Bosch Charpenay, P. A. Rosenthal, "FTIR-based nondestructive method for metrology of depths in polysilicon-filled trenches", Proceedings of SPIE, edited by D. J. Herr, Vol. 5038, 185-190, 2003.
3. B. D. Bunday, M. Bishop, J. R. Swyers, K. R. Lensing, "Quantitative profile-shape measurement study on a CD-SEM with application to etch-bias control and several different CMOS features", Proceedings of SPIE, edited by D. J. Herr, Vol. 5038, 383-395, 2003.
4. C.J. Raymond, M. Littau, R. Markle, M. Purdy, "Scatterometry for Shallow Trench Isolation (STI) Process Metrology", Proceedings of the SPIE, Vol. 4344, 716-725, 2001.
5. Xinhui Niu, N. Jakatdar, B. Junwei, and C.J. Spanos, "Specular Spectroscopic Scatterometry", IEEE Transactions on Semiconductor Manufacturing 14(2), 97-111, 2001.
6. M.G.Moharam, E.B.Grann, D.A.Pommet, and T.K.Gaylord, J. Opt. Soc. Am. A, 12(5), 1068-1076, 1995.
7. V.A. Ukraintsev, M. Kulkarni, C. Baum, K. Kirmse, M. Guevremont, S. Lakkapragada, K. Bhatia, P. Herrera, and U. Whitney, Proceedings of SPIE 2002, 4689-21.
8. C. Ygartua and M. Liaw, Thin Solid Films 313-314, 237-242, 1998.