Electrical properties of TaN-Cu nanocomposite thin films

Ceramics International

Volumn 30, Issue 7, 2004, Pages 1879-1883

  Wang, C M ^a   Hsieh, J H ^a   Fu, Y Q ^a   Li, C ^a   Chen, T P ^b   Lam, U T ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

B. Nanocomposites; Resistivity; TaN Cu; Thermal coefficient of resistivity; Thin film resistor

Indexed keywords

ANNEALING; COPPER COMPOUNDS; DEPOSITION; ELECTRIC CONDUCTIVITY; GRAIN GROWTH; NANOSTRUCTURED MATERIALS; NUCLEATION; SPUTTERING; TANTALUM COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

RAPID THERMAL PROCESSING (RTP); TAN-CU; THERMAL COEFFICIENT OF RESISTIVITY (TCR); THIN FILM RESISTORS (TFR);

THIN FILMS;

EID: 4344576489     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2003.12.051     Document Type: Conference Paper

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