The role of aluminum in the crystallization of Cr-Si-Ni resistive films

Materials Science and Engineering: A

Volumn 339, Issue 1-2, 2003, Pages 297-301

  Dong, Xianping ^a   Wu, Jiansheng ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Aluminum; Crystallization; Resistive films

Indexed keywords

ALUMINUM; AMORPHOUS MATERIALS; ANNEALING; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; METALLIC FILMS; SPUTTERING;

COARSENING;

CHROMIUM ALLOYS;

ALUMINUM; CHROMIUM; CRYSTALLIZATION; INORGANIC COATING; NICKEL; RESISTANCE; SILICON;

EID: 0037413744     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00153-3     Document Type: Article

References (5)

1. R. Glang, R.A. Holmwood, S.R. Herd, J. Vac. Sci. Technol. 4 (1967) 163.
2. K. Hieber, R. Dittmann, Thin Solid Films 36 (1976) 357.
3. A. Heinrich, J. Schumann, H. Vinzelberg, et al., Thin Solid Films 223 (1993) 311.
4. A. Heinrich, C. Gladun, I. Monch, Int. J. Electronics 73 (1992) 883.
5. K.H. Bäther, G. Zies, R. Voigtmann, et al., Thin Solid Films 188 (1990) 67.