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Volumn 462-463, Issue SPEC. ISS., 2004, Pages 330-333
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Study of leakage mechanisms of the copper/Black Diamond™ damascene process
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Author keywords
Conduction mechanisms; Interconnects; Low k
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Indexed keywords
CONDUCTION MECHANISMS;
DAMASCENE STRUCTURES;
ELECTROCHEMICAL PLATING;
CARBON;
DIELECTRIC MATERIALS;
DOPING (ADDITIVES);
ELECTROCHEMISTRY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
THICKNESS MEASUREMENT;
THIN FILMS;
COPPER;
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EID: 4344560406
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2004.05.051 Document Type: Article |
Times cited : (15)
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References (11)
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