Ultra high power light-emitting diodes with electroplating technology

IEEE Conference on Electron Devices and Solid-State Circuits 2007, EDSSC 2007

Volumn , Issue , 2007, Pages 19-22

  Su, Y K ^a,b   Chen, K C ^b   Lin, C L ^c  

^a IEEE

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPLATING; COPPER PLATING LAYERS; LUMINOUS INTENSITY;

CHIP SCALE PACKAGES; ELECTROPLATING; GALLIUM NITRIDE; HEAT LOSSES; LUMINANCE; TEMPERATURE CONTROL;

LIGHT EMITTING DIODES;

EID: 43049157764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDSSC.2007.4450052     Document Type: Conference Paper

References (8)

1. S. Nakamura, T. Mukai and M. Senoh, "High-Power GaN P-N Junction Blue-Light-Emitting," Jpn. J. Appl. Phys. ,vol. 30, no. 12A,pp. L1998-2001, 1991.
2. F.A. Kish, D.A. DeFevere, D.A. Vanderwater,G.R. Trott, R.J. Weiss and J.S. Major, Jr."High luminous flux semiconductor wafer bonded AIGalnP/GaP large-area emitters," ELECTRONICS LETERS, Vol. 30, No. 21, p.p.1790-1792, 1994
3. P. C. Tsai, Ricky W. Chuang, and Y. K. Su, "Lifetime Tests and Junction-Temperature Measurement of InGaN LightEmitting Diodes Using Patterned Sapphire Substrates," JOURNAL OF LIGHTWAVE TECHNOLOGY, VOL. 25, NO. 2, p.p. 591-596, 2007
4. B. S. Tan, S. Yuan, X. J. Kang, "Performance enhancement of InGaN light-emitting diodes by laser lift-off and transfer from sapphire to copper substrate," Applied Physics Letters, v 84, n 15, p.p. 2757-2759, 2004.
5. S.L. Chen, S.J. Wang, K.M. Uang, T.M. Chen, W.C. Lee, and B.W. Liou, "Fabrication of Dicing-Free Vertical-Structured High-Power GaN-Based Light-Emitting Diodes With Selective Nickel Electroplating and Patterned Laser Liftoff Techniques, "IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 19, NO. 6, p 351-353, 2007
6. O. Kuckmann, "High power LED arrays special requirements on packaging technology," in Proc. of SPIE The Int. Soc. for Optical Engineering, vol. 6134, p.p.613404(1)-613404(8), 2006
7. R. C. Jordan, J. Bauer, and H. Oppermann, "Optimized heat transfer and homogeneous color converting for Ultra High Brightness LED Package," in Proc. of SPIE The Int. Soc. for Optical Engineering, Strasbourg, vol. 6198, pp. 61980B1-61980B12, 2006.
8. M. Arik, J. Petroski, S. Weaver, "Thermal challenges in the future generation solid state lighting applications: light emitting diodes," in Conf. 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, San Diego,2002,pp.113-120.