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Volumn 30, Issue 21, 1994, Pages 1790-1792

High luminous flux semiconductor wafer-bonded AIGalnP/GaP large-area emitters

Author keywords

Gallium phosphide; Light emitting diodes; Wafer bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; LASER PULSES; LIGHT SOURCES; MICROPROCESSOR CHIPS; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

EID: 0028530007     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19941232     Document Type: Article
Times cited : (30)

References (5)
  • 2
    • 0010436436 scopus 로고
    • Twofold efficiency improvement in high performance AIGalnP light-emitting diodes in the 55-620 nm spectral region using a thick GaP window layer
    • HUANG, K.H., YU, J.G., KUO, C.P., FLETCHER, R.M., OSENTOWSKI, T.D., STINSON, L.J., CRAWFORD, M.G., and LIAO, A.S.H.: ‘Twofold efficiency improvement in high performance AIGalnP light-emitting diodes in the 55-620 nm spectral region using a thick GaP window layer’, Appl. Phys. Lett., 1992, 61, (9), pp. 1045–1047
    • (1992) Appl. Phys. Lett , vol.61 , Issue.9 , pp. 1045-1047
    • HUANG, K.H.1    YU, J.G.2    KUO, C.P.3    FLETCHER, R.M.4    OSENTOWSKI, T.D.5    STINSON, L.J.6    CRAWFORD, M.G.7    LIAO, A.S.H.8
  • 4
    • 85024209482 scopus 로고
    • III-V Photocathode bonded to a foreign transparent substrate
    • ANTYPAS, G.A., and KINTER, M.A.: ‘III-V Photocathode bonded to a foreign transparent substrate’, US Patent 3,769,536, 1973
    • (1973) US Patent 3,769,536
    • ANTYPAS, G.A.1    KINTER, M.A.2
  • 5
    • 21544474791 scopus 로고
    • Wafer fusion: A novel technique for optoelectronic device fabrication and integration
    • LIAU, Z.L., and MULL, D.E.: ‘Wafer fusion: A novel technique for optoelectronic device fabrication and integration’, Appl. Phys. Lett., 1990, 56, (8), pp. 737–739
    • (1990) Appl. Phys. Lett. , vol.56 , Issue.8 , pp. 737-739
    • LIAU, Z.L.1    MULL, D.E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.