Hot embossing of microstructures: Characterization of friction during demolding

Microsystem Technologies

Volumn 14, Issue 6, 2008, Pages 767-773

  Worgull, M ^a   Hetu J F ^b   Kabanemi, K K ^b   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FRICTION; INJECTION MOLDING; PROJECT MANAGEMENT;

HOT EMBOSSING; INDUSTRIAL STANDARDS;

MICROSTRUCTURE;

EID: 43049113845     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0492-0     Document Type: Article

References (12)

1. Benzler T, Piotter V, Hanemann T, Mueller K, Norajitra P, Ruprecht R, Hausselt J (1999) Innovations in molding technologies for microfabrication. In: SPIE conference on micromachining and microfabrication process technology V, Santa Clara, California, September
2. Gale MT, Kane J, Knop K (1978) ZOD images: embossable surface-relief structures for color and black-and-white reproduction. J Appl Photogr Eng 4:41
3. Hanemann T, Heckele M, Piotter V (2000) Current status of micromolding technology. Polymer News 25:224-229
4. Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Micromech Microeng 14:R1-R14
5. Heckele M, Bacher W, Hanemann T, Ulrich H (1997) Hot embossing and injection molding for microoptical components. SPIE conference, San Diego
6. Juang Y, Lee LJ, Koelling KW (2002a) Hot embossing in microfabrication. Part 1: experimental. Polymer Eng Sci 42(3):539-550
7. Juang Y, Lee LJ, Koelling KW (2002b) Hot embossing in microfabrication. Part 2: rheological characterization and process analysis. Polymer Eng Sci 42(3):551-556
8. Michel A, Ruprecht R, Harmening M, Bacher W.,Abformung von Mikrostrukturen auf prozessierten Wafern" KfK Bericht 5171, Dissertation A. Michel, Universität Karlsruhe, Institut für Mikrostrukturtechnik 1993
9. Truckenmüller R (2002) Herstellung dreidimensionaler Mikrostrukturen aus Polymermembranen. Dissertation R. Truckenmüller, Universität Karlsruhe, Institut für Mikrostrukturtechnik
10. Worgull M, Heckele M (2004) New aspects of simulation in hot embossing. Microsystem Technol 10:432-437
11. Worgull M, Heckele M, Schomburg W (2004) Large scale hot embossing. In: DTIP conference, Montreux
12. Worgull M, Heckele M, Schomburg WK, Analysis of the micro hot embossing process, Forschungszentrum Karlsruhe, FZKA-Bericht 6922