Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process

Journal of Alloys and Compounds

Volumn 458, Issue 1-2, 2008, Pages 323-329

  Liu, Wei ^a   Wang, Chunqing ^a   Tian, Yanhong ^a   Li, Mingyu ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Shenzhen University Town   (China)

Author keywords

Diffusion; Intermetallics; Laser processing; SEM; Surfaces and interfaces

Indexed keywords

INTERMETALLICS; LASER CHEMISTRY; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; THERMAL AGING; THERMAL CYCLING;

ISOTHERMAL AGING; LASER PROCESSING; RIGHT-ANGLED SOLDER JOINTS;

SOLDERED JOINTS;

EID: 42949090285     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.03.146     Document Type: Article

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